Success case about ITX box cooling solution

Reasonable and professional theoretical research before product development gives customers greater confidence，excellent experience, and high-quality service. Provided and launched the full sets of thermal module which included heat pips+fins and blower cooling fans for their ITX BOX

We dedicated to this project, be responsible for the whole process, Participate in customer's preliminary design cooperation, research, evaluation, development, verification ,production--- To achieve worry free cooling for customers and pave the way for the reliability of their products.

Through thermal simulation to check if the first choose products works perfectly.

From thermal simulation we found out Overall high risk:the core risk is that the cooling module cannot handle the current heating power. Insufficient air volume in the system poses a risk of SOC temperature. So the current cooling module is unable to solve the core heat generation rate of 70W.

Based on the result of thermal simulation we suggested some modification advise

50. Adjust the gap between the small blower fans and the cooler fins, and seal the gap with acetic acid adhesive tape
50. Add thermal conductive silicone pad between copper tube and MOS
50. Increase the speed of the blower and increase the air volume
50. The opening rate of the air outlet increase to 70%....etc

Final test records is perfect after adjustment,and final installation photo;